Effect of Cu Content and Growth Velocity on the Microstructure Properties of the Directionally Solidified Al-Mn-Cu Ternary Alloys

Özet

In this work, influences of composition (Cu content) and growth velocity (V) on the microstructure (dendritic spacing) of Al–Mn–Cu ternary alloys have been investigated. Al–1.9Mn–xCu (x=0.5, 1.5 and 5 wt. %) alloys were prepared using metals of 99.90% high purity in the vacuum atmosphere. These alloys were directionally solidified upwards under various growth velocities (8.3–978 ?m/s) using a Bridgman-type directional solidification furnace at a constant temperature gradient (7.1 K/mm). Measurements of primary dendrite arm spacing (??) of the samples were carried out and then expressed as functions of growth velocity and Cu content. Especially, cell-dendritic transition was detected for low growth velocity (41.6 ?m/s) for alloys containing 0.5 and 1.5Cu. It has been found that the values of???decrease with increasing V and decreasing Cu content.